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Educational and Information news blog on passive electronic components. News, articles, videos, featured on capacitors, inductors, resistors

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locale en_US
type website
title Passive Blog
description Educational and Information news blog on passive electronic components. News, articles, videos, featured on capacitors, inductors, resistors
url https://passive-components.eu/
site_name Passive Components Blog
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0 28 171 0 0 0
  • [H2] Murata Introduces Crystal and NTC Set for Automotive UWB Timing
  • [H2] Murata New MLCC Bulk Case Packaging Cuts Packaging Material by 99%
  • [H2] KYOCERA AVX Introduces Traction‑Grade DC Link Film Capacitors
  • [H2] Würth Elektronik Expanded Capacity for Validation and Services in Asia
  • [H2] KYOCERA AVX MIL-PRF-32535 BME NP0 MLCCs Approved to the DLA QPD
  • [H2] Murata Automotive MLCCs Push Capacitance Limits for ADAS and Power Lines
  • [H2] Würth Elektronik Releases Heat Sinks for TO and IC packages
  • [H2] Würth Elektronik Unveils High-Current Automotive Power Inductor
  • [H2] Würth Elektronik Presents Differential Pressure Sensor for HVAC and Medical
  • [H2] Würth Elektronik and Grinn Launch Edge AI Cooperation
  • [H2] Murata New Vibration Sensor Targets High‑Frequency Predictive Maintenance
  • [H2] Kyocera Releases 30fs Jitter Differential Clock Oscillator
  • [H2] KYOCERA AVX Extends Ultra‑Broadband RF Capacitor Series
  • [H2] Kyocera Offers Small SAW Filters for IoT RF Modules
  • [H2] Würth Elektronik Component Data Live in Accuris
  • [H2] April 2026 Interconnect, Passives and Electromechanical Components Market Insights
  • [H2] ECIA March 2026 Industry Pulse Points to Best Sales Climate in Five Years
  • [H2] March 2026 Interconnect, Passives and Electromechanical Components Market Insights
  • [H2] Middle East Conflict: The Potential Impact to Passive Components
  • [H2] Inductor Technology Dossier
  • [H2] February 2026 Interconnect, Passives and Electromechanical Components Market Insights
  • [H2] ECIA February 2026 Industry Pulse Signals Strong Component Growth
  • [H2] Inductors and Ferrite Beads Price Hikes 
  • [H2] Resistor Technology Dossier
  • [H2] AI Servers Demand is Driving Tantalum Capacitor Price Hikes
  • [H2] DMASS Reports Europe Components Up 9.8% in Q4 2025
  • [H2] ECIA January 2026 Reports Strong Sales Confidence
  • [H2] Modeling Fringing Field Losses in Inductors & Transformers
  • [H3] YAGEO Introduces C0G Flexible Termination Automotive MLCCs
  • [H3] SCHURTER Releases SMT Micro Switch for Compact HMIs
  • [H3] binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability
  • [H3] Vishay Introduced Thin Film Submount Platform for Optical and RF Modules
  • [H3] Murata Introduces Crystal and NTC Set for Automotive UWB Timing
  • [H3] Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages
  • [H3] Modeling Fringing Field Losses in Inductors & Transformers
  • [H3] YMIN Introduces Polymer Tantalum Capacitors for AI Server SSDs
  • [H3] Littelfuse Expands High-Voltage TVS Diodes
  • [H3] Trending Tags
  • [H3] Modeling Fringing Field Losses in Inductors & Transformers
  • [H3] Why Power Inductors Use a Ferrite Core With an Air Gap
  • [H3] Transformer-Based Power-Line Harvester Magnetic Design
  • [H3] Thermal Modeling of Magnetics
  • [H3] Standard vs Planar LLC transformers Comparison for Battery Chargers
  • [H3] How Modern Tools Model Magnetic Components for Power Electronics
  • [H3] Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool
  • [H3] 2026 Power Magnetics Design Trends: Flyback, DAB and Planar
  • [H3] Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power
  • [H3] Trending Tags
  • [H3] YAGEO Introduces C0G Flexible Termination Automotive MLCCs
  • [H3] SCHURTER Releases SMT Micro Switch for Compact HMIs
  • [H3] binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability
  • [H3] Vishay Introduced Thin Film Submount Platform for Optical and RF Modules
  • [H3] Murata Introduces Crystal and NTC Set for Automotive UWB Timing
  • [H3] Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages
  • [H3] Modeling Fringing Field Losses in Inductors & Transformers
  • [H3] YMIN Introduces Polymer Tantalum Capacitors for AI Server SSDs
  • [H3] Littelfuse Expands High-Voltage TVS Diodes
  • [H3] Trending Tags
  • [H3] Modeling Fringing Field Losses in Inductors & Transformers
  • [H3] Why Power Inductors Use a Ferrite Core With an Air Gap
  • [H3] Transformer-Based Power-Line Harvester Magnetic Design
  • [H3] Thermal Modeling of Magnetics
  • [H3] Standard vs Planar LLC transformers Comparison for Battery Chargers
  • [H3] How Modern Tools Model Magnetic Components for Power Electronics
  • [H3] Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool
  • [H3] 2026 Power Magnetics Design Trends: Flyback, DAB and Planar
  • [H3] Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power
  • [H3] Trending Tags
  • [H3] Passive Components News
  • [H3] YAGEO Introduces C0G Flexible Termination Automotive MLCCs
  • [H3] Vishay Introduced Thin Film Submount Platform for Optical and RF Modules
  • [H3] Murata Introduces Crystal and NTC Set for Automotive UWB Timing
  • [H3] Modeling Fringing Field Losses in Inductors & Transformers
  • [H3] YMIN Introduces Polymer Tantalum Capacitors for AI Server SSDs
  • [H3] Littelfuse Expands High-Voltage TVS Diodes
  • [H3] DigiKey Adds 31k New In‑Stock Parts in Q1 2026
  • [H3] Miniaturization of Tantalum Capacitors: Structural Limit Under Constant Rating
  • [H3] Murata New MLCC Bulk Case Packaging Cuts Packaging Material by 99%
  • [H3] Wk 17 Electronics Supply Chain Digest
  • [H3] Exxelia Introduces SMD High‑Voltage Mica Capacitors
  • [H3] Modelithics Releases COMPLETE v26.1 for Keysight ADS
  • [H3] April 2026 Interconnect, Passives and Electromechanical Components Market Insights
  • [H3] SPICE Simulation of Non-Linear Resistors: Vishay’s Thermistor and PPTC Modelling Ecosystem
  • [H3] Würth Elektronik Expanded Capacity for Validation and Services in Asia
  • [H3] Samsung Introduces Ultra-High-Voltage 1500 V MLCCs for xEV Powertrains
  • [H3] YAGEO Q1 2026 Results: AI Servers and Pricing Power Behind a Moderate Q2 Outlook
  • [H3] TDK Introduces High‑Voltage Common‑Mode Chokes for Compact 1250 V DC Converters
  • [H3] Vishay Extends Power Inductors for DC/DC with 1212 Compact Case
  • [H3] Modeling Planar Magnetics Temperature: Practical Guidelines for Power Electronics Engineers
  • [H3] YAGEO Releases Ferrite Shielded Power Inductors for High‑Density Designs
  • [H3] Samsung Presents MLCC Selection Guide for Humanoids and Robotic Applications
  • [H3] Upcoming Events
  • [H3] Understanding and Selecting Capacitors – Fundamentals, Technologies and Latest Trends
  • [H3] From Grid to Motion: How Industrial Electrification is Redefining Power System Design
  • [H3] ESCC Space Splice connectors
  • [H3] Popular Posts
  • [H3] Buck Converter Design and Calculation
  • [H3] Boost Converter Design and Calculation
  • [H3] Flyback Converter Design and Calculation
  • [H3] LLC Resonant Converter Design and Calculation
  • [H3] MLCC and Ceramic Capacitors
  • [H3] Dual Active Bridge (DAB) Topology
  • [H3] What Electronics Engineer Needs to Know About Passive Low Pass Filters
  • [H3] Capacitor Charging and Discharging
  • [H3] Newsletter Subscription
  • [H3] News Archive
  • [H3] Wk 17 Electronics Supply Chain Digest
  • [H3] Wk 16 Electronics Supply Chain Digest
  • [H3] Wk 15 Electronics Supply Chain Digest
  • [H3] Wk 14 Electronics Supply Chain Digest
  • [H3] Wk 13 Electronics Supply Chain Digest
  • [H3] Popular Articles
  • [H3] Buck Converter Design and Calculation
  • [H3] Boost Converter Design and Calculation
  • [H3] Flyback Converter Design and Calculation
  • [H3] LLC Resonant Converter Design and Calculation
  • [H3] MLCC and Ceramic Capacitors
  • [H3] Dual Active Bridge (DAB) Topology
  • [H3] What Electronics Engineer Needs to Know About Passive Low Pass Filters
  • [H3] Capacitor Charging and Discharging
  • [H3] MLCC Case Sizes Standards Explained
  • [H3] Newsletter Subscription
  • [H3] Inter-connect, Electro-mechanical and Sensors
  • [H3] SCHURTER Releases SMT Micro Switch for Compact HMIs
  • [H3] binder Releases Tool‑Tightenable M12 Connectors for Improved Reliability
  • [H3] Kyocera Developed Multilayer Ceramic Core Substrate for AI Packages
  • [H3] Heatsink Design and Thermal Interface Materials for Reliable Electronics
  • [H3] Amphenol Explanded Liquid Cooling Connectors for AI, ESS and EV Systems
  • [H3] Hirose Introduced BGA connector for PCIe Gen6 for AI and Edge Computing
  • [H3] Littelfuse Presents Ultra-Miniature Half-Pitch SMT DIP Switches
  • [H3] SCHURTER Releases Compact SMT DIP Switches
  • [H3] Molex Completes Acquisition of Smiths Interconnect, Expanding Portfolio of High-Reliability Connectivity Solutions
  • [H3] Würth Elektronik Releases Heat Sinks for TO and IC packages
  • [H3] Binder Introduces Triangular Moulding for M16 and M12 Cable Connectors
  • [H3] Bourns Expands its Modular Contacts for Power-Dense Systems
  • [H3] Samtec AcceleRate Slim ARC6 Cable Assemblies with New Signaling Options
  • [H3] Hirose Electric to Establish Automotive Connector Plant in India
  • [H3] Binder Extends NCC Circular Connectors for Harsh Environments
  • [H3] Samtec ANSI/VITA 90 Connectors: Rugged Small Form Factor Standard
  • [H3] e-Symposium: ESA SPCD, PCNS, WE Digital Days
  • [H3] ESA SPCD 26 Call for Papers Extended to 30th March
  • [H3] Overvoltage and Transient Protection for DC/DC Power Modules
  • [H3] Choosing the Right Capacitor: The Importance of Accurate Measurements
  • [H3] RF Inductors: Selection and Design Challenges for High-Frequency Circuits
  • [H3] Transformer Safety IEC 61558 Standard
  • [H3] Transformer Design Optimization for Power Electronics
  • [H3] Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems
  • [H3] Power Inductors Future: Minimal Losses and Compact Designs
  • [H3] Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters
  • [H3] Advances in the Environmental Performance of Polymer Capacitors
  • [H3] How to Manage Supercapacitors Leakage Current and Self Discharge 
  • [H3] Qualification of Commercial Supercapacitors for Space Applications
  • [H3] Modeling Fringing Field Losses in Inductors & Transformers
  • [H3] Heatsink Design and Thermal Interface Materials for Reliable Electronics
  • [H3] Why Power Inductors Use a Ferrite Core With an Air Gap
  • [H3] Transformer-Based Power-Line Harvester Magnetic Design
  • [H3] Thermal Modeling of Magnetics
  • [H3] Standard vs Planar LLC transformers Comparison for Battery Chargers
  • [H3] How Modern Tools Model Magnetic Components for Power Electronics
  • [H3] Advanced Loss Modeling for Planar Magnetics in the Frenetic Planar Tool
  • [H3] Mastering Galvanic Isolation in Power Electronics: Methods, Standards, and Implementation
  • [H3] 2026 Power Magnetics Design Trends: Flyback, DAB and Planar
  • [H3] Enabling Software‑Defined Vehicle Architectures: Automotive Ethernet and Zonal Smart Power
  • [H3] Calculating Resistance Value of a Flyback RC Snubber 
  • [H3] Miniaturization of MLCCs and Electrolytics, KAVX Tech Chat
  • [H3] One‑Pulse Characterization of Nonlinear Power Inductors
  • [H3] Thermistor Linearization Challenges
  • [H3] Coaxial Connectors and How to Connect with PCB
  • [H3] PCB Manufacturing, Test Methods, Quality and Reliability
  • [H3] Transformer Behavior – Current Transfer and Hidden Feedback
  • [H3] Transient Suppression Guide
  • [H3] Overvoltage and Transient Protection for DC/DC Power Modules
  • [H3] Choosing the Right Capacitor: The Importance of Accurate Measurements
  • [H3] RF Inductors: Selection and Design Challenges for High-Frequency Circuits
  • [H3] Transformer Safety IEC 61558 Standard
  • [H3] 3-Phase EMI Filter Design, Simulation, Calculation and Test
  • [H3] Transformer Design Optimization for Power Electronics
  • [H3] Common Mode Chokes Selection for RF Circuits in Next-Generation Communication Systems
  • [H3] Capacitor Self-balancing in a Flying-Capacitor Buck Converter
  • [H3] How to Select Ferrite Bead for Filtering in Buck Boost Converter
  • [H3] Power Inductors Future: Minimal Losses and Compact Designs
  • [H3] Percolation Phenomenon: Degradation of Molded Power Inductors in DC/DC Converters
  • [H3] New Technologies & Innovations
  • [H3] Nanocrystalline Cores for Low‑Loss MHz Chip Inductors
  • [H3] Researchers Presented Lignin-based Electrolyte for 4V Supercapacitors with Low Self‑Discharge
  • [H3] Penn State Demonstrated Polymer Alloy Capacitor Film with 4× Energy Density up to 250C
  • [H3] TU Wien Sets New Benchmark in Superconducting Vacuum Gap nanoCapacitors
  • [H3] Researchers Demonstrated 32nm Aluminum Vacuum Gap Capacitor
  • [H3] Researchers Demonstrated 30nm Ferroelectric Capacitor for Compact Memory
  • [H3] Reliability Improvement in BaTiO3 MLCCs Using Ni–Sn and Ni–In Alloy Electrodes
  • [H3] Researchers Present Novel Graphene-Based Material for Supercapacitors
  • [H3] Lightweight Model for MLCC Appearance Defect Detection
  • [H3] High Energy Density Polymer Film Capacitors via Molecular and Interfacial Design
  • [H3] Enhancing Energy Density in Nanocomposite Dielectric Capacitors
  • [H3] Researchers Proposed Enhanced Energy Storage MLCC
  • [H3] EPCI Members
  • [H3] Core Members
  • [H3]
  • [H3]

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